JPH0356340Y2 - - Google Patents
Info
- Publication number
- JPH0356340Y2 JPH0356340Y2 JP4877987U JP4877987U JPH0356340Y2 JP H0356340 Y2 JPH0356340 Y2 JP H0356340Y2 JP 4877987 U JP4877987 U JP 4877987U JP 4877987 U JP4877987 U JP 4877987U JP H0356340 Y2 JPH0356340 Y2 JP H0356340Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- gate
- lead frame
- cavities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 52
- 238000000465 moulding Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 description 9
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4877987U JPH0356340Y2 (en]) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4877987U JPH0356340Y2 (en]) | 1987-03-30 | 1987-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63154208U JPS63154208U (en]) | 1988-10-11 |
JPH0356340Y2 true JPH0356340Y2 (en]) | 1991-12-18 |
Family
ID=30870630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4877987U Expired JPH0356340Y2 (en]) | 1987-03-30 | 1987-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0356340Y2 (en]) |
-
1987
- 1987-03-30 JP JP4877987U patent/JPH0356340Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63154208U (en]) | 1988-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR940000740B1 (ko) | 레진몰드 반도체의 제조방법 및 장치 | |
JPH0356340Y2 (en]) | ||
US20050287715A1 (en) | Method for encapsulating lead frame packages | |
US3753634A (en) | Molding means for strip frame semiconductive device | |
US5897883A (en) | Mold having projections for inhibiting the formation of air pockets | |
JP2834257B2 (ja) | 半導体装置の製造方法およびモールド装置 | |
JPH065645A (ja) | 半導体素子の樹脂成形方法 | |
JPH01232733A (ja) | 半導体樹脂封止装置 | |
JPH04196330A (ja) | 半導体樹脂封止装置 | |
JPS5994428A (ja) | 半導体用樹脂封止金型 | |
JPS59969B2 (ja) | 半導体装置の封止方法 | |
JPS6233748B2 (en]) | ||
JP2545409Y2 (ja) | 半導体素子封入金型 | |
JP3185354B2 (ja) | 半導体装置の製造方法及び半導体装置の樹脂封止装置 | |
JPH0625959Y2 (ja) | 半導体装置 | |
JPS6197955A (ja) | リ−ドフレ−ム | |
JPS6311723Y2 (en]) | ||
JPS635226Y2 (en]) | ||
KR20070035725A (ko) | 2단 게이트 구조를 갖는 몰딩용 다이 | |
KR0129218Y1 (ko) | 볼 그리드 어레이 반도체 패키지 성형용 트랜스터 금형구조 | |
JPH0126110Y2 (en]) | ||
KR0163872B1 (ko) | 본딩 와이어 불량 방지용 블로킹 리드를 갖는 패킹 구조 | |
KR20010064385A (ko) | 이중 게이트가 구비된 캐버티를 포함하는 성형 금형 | |
KR0122888Y1 (ko) | 반도체 팩키지 성형용 몰드 | |
JPH05138699A (ja) | 電子部品及びその製造方法 |